Model R-DT650 is forComposite Current Collector Cu Coatingand EMI EMI Shielding Filmvacuum system developed forRoll-to-Roll CoatingEquipment，supportingDouble-Sided Simultaneous Evaporationcopper（Cu），single-side uniformity ±3%。
1μm coppersheet resistance up to ≤0.03Ω/sq，EMI shielding effectiveness ≥60dB，and enables in-situ CuO blackening treatment（reflectance ≤20%），suitable forused for PET/PI etc. 10μm belowultra-thin substrates。
electron beamevaporationpower 30-300kW，web speed 5-30m/min，forcomposite current collectorsandEMI shielding functional filmprovidingefficient mass production platform。
R-DT650 throughDouble-Sided Simultaneous Evaporationachievingcopperlayer uniformitydeposition（±3%），1μm copperlayer sheet resistance ≤0.03Ω/sq，shielding effectiveness ≥60dB，meetingEMI Shielding Filmandcomposite current collectorsapplicationsneeds。
supportingin-situ CuO blackening treatment，reflectance ≤20%，suitable forwith PET/PI 10μm belowultra-thin substrates，forEMI shieldingandBatteriescurrent collectorprovidingstablemass productionsolution。
Double-Sided Simultaneous Evaporationcopperlayer，uniformity ±3%，productivityandcombining consistency。
1μm copperlayer sheet resistance ≤0.03Ω/sq，shielding effectiveness ≥60dB。
in-situ CuO blackening treatment，reflectance ≤20%，suitable forwithultra-thin substrates。
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