Semiconductors Equipment

Model L — DPC Ceramic Metallization System

The Model L (L1000) is a three-chamber vertical in-line DPC (Direct Plated Copper) ceramic metallization coating system, purpose-built for high-end electronic device heat dissipation and high-density integration.

It precisely targets advanced fields such as semiconductors, power devices and optical communications, delivering a system-level solution for high-aspect-ratio through-hole metallization and high-quality thin-film deposition on DPC ceramic substrates.

Engineered for automotive LiDAR VCSEL packaging, AI computing server substrates and RF front-end modules, it enables high productivity at low cost.

Would you like to learn more? Then click on the system or have a look at the applications.