Introduction

The L1000 is a three-chamber vertical in-line DPC (Direct Plated Copper) ceramic metallization coating system, purpose-built for high-end electronic device heat dissipation and high-density integration. It precisely targets semiconductors, power devices and optical communications, solving core process bottlenecks in AI computing server substrates, automotive LiDAR VCSEL packaging and RF front-end modules.

Its innovative three-chamber vertical in-line architecture places the core coating zone in the central chamber, flanked by reciprocating product-rack chambers, forming an efficient, enclosed continuous production loop. Products are vertically top-loaded with bottom-mounted fixtures, effectively preventing coating flaking and surface dust accumulation. This architecture overcomes the technical barriers of conventional PVD sputtering in uniformity and adhesion, empowering high-quality mass production of DPC ceramic substrates with low-temperature, high-speed and high-ionization performance.